High Voiding on Thermal Pad within JTAG-SMT2-NC Surface-Mount Programming Module

[RyWeb]

Hello,

Wasn't sure where to post this question - hopefully this is an appropriate board.

We're seeing very high levels of voiding on the thermal pads of the mounted leadless device. The attached x-ray images show presence of solder.

Is an expected level of coverage that meets Digilent acceptability criteria? Or is this abnormal?

These images were taken as received, prior to being exposed to any internal processing.

[RyWeb]

Following up on this thread - is there a better board to post this to?

[JColvin]

Hi @RyWeb,

I apologize for the delay. I have reached out to our contract manufacturer for some better insight into your question.

Thanks,
JColvin

[JColvin]

Hi @RyWeb,

I got a reply sooner than I expected from the Engineering Services Manager.

I told assured that what you are seeing is within specifications and that each new batch has their solder voids randomly inspected via Xray to confirm their compliance.

If you have any questions or experience any difficulty with the products, please let me know.

Thanks,
JColvin