RyWeb

Following up on this thread - is there a better board to post this to?

Hello, Wasn't sure where to post this question - hopefully this is an appropriate board. We're seeing very high levels of voiding on the thermal pads of the mounted leadless device. The attached x-ray images show presence of solder. Is an expected level of coverage that meets Digilent acceptability criteria? Or is this abnormal? These images were taken as received, prior to being exposed to any internal processing.